| 孔令凯,杨朝均,齐浩,马永红,杨晓萌.基于SAO结构的关键技术要素识别研究——以高速芯片为例[J].数字图书馆论坛,2023,(10):40~51 |
| 基于SAO结构的关键技术要素识别研究——以高速芯片为例 |
| Identification of Key Technology Elements Based on SAO Structure: Taking High-Speed Chip as an Example |
| 投稿时间：2023-08-25 |
| DOI：10.3772/j.issn.1673-2286.2023.10.005 |
| 中文关键词: 关键技术要素；高速芯片；SAO结构；中心性；结构洞；覆盖度 |
| 英文关键词: Key Technology Element; High-Speed Chip; SAO Structure; Centrality; Structural Hole; Degree of Coverage |
| 基金项目:本研究得到国家自然科学基金“区域创新系统网络结构与产业关键共性技术创新涌现的构效关系与作用机理研究”（编号：
71874040）、“基于专利数据挖掘的我国芯片产业关键技术研发路径选择研究”（编号：72104064）、“基于多源文本挖掘的我国高端装备制造业关键共性技术突破路径研究”（编号：23XJC630006）资助。 |
| 作者 | 单位 | | 孔令凯 | 昆明理工大学管理与经济学院 | | 杨朝均 | 昆明理工大学管理与经济学院 | | 齐浩 | 昆明理工大学管理与经济学院 | | 马永红 | 哈尔滨工程大学经济管理学院 | | 杨晓萌 | 江苏科技大学经济与管理学院 |
|
| 摘要点击次数: 989 |
| 全文下载次数: 567 |
| 中文摘要: |
| 面对日益严峻的技术封锁及遏制风险，深入技术本身，掌握技术系统内部关键组件、工艺以及方法等技术要素是突破技术瓶颈的关键环节。归纳关键技术要素的3个特征——关键性、创新性以及基础性。以高速芯片为例，利用专利文献数据，分析高速芯片专业术语。引入SAO（Subject-Action-Object）语义结构，提取高速芯片技术要素，以技术要素为节点、技术要素关联强度为边，构建高速芯片SAO语义网络。借鉴社会网络分析方法，量化技术要素权利、地位以及创新力，识别高速芯片系统内关键技术要素，探究高速芯片技术结构，寻找技术卡点。实证结果显示，高速芯片“卡脖子”技术中存在“高速数据”“单片微机”“fpga芯片”“晶圆”4个关键技术要素。 |
| 英文摘要: |
| Facing the growing risk of technological embargoes and containment, digging deeper into the key core technology information and mastering the key technology elements within the technology system, such as key components, processes, and methods, is the premise of breaking through the technology bottleneck. The three characteristics of key technology elements are summarized as critical, innovative, and fundamental. This research takes the high-speed chip as an example, adopts patent literature data, and analyzes terminologies for high-speed chips. We introduce SAO (Subject-Action-Object) semantic structure, extract high-speed chip technology elements, and take technology elements as nodes and technology element association strength as edges to construct high-speed chip SAO semantic network. Afterwards, we draw on social network analysis methods, quantify technology element rights, status, and innovation capability, identify key technology elements inside high-speed chip system, explore high-speed chip technology structure, and find technology chokepoints. The research results show that there are four key technology elements of stranglehold on technology: “high-speed data”, “single-chip microcomputer”, “fpga chip”,and “wafer”. |
|
查看全文
查看/发表评论 下载PDF阅读器 |
| 关闭 |
|
|
|
