| 程如烟,邢小宇,李兆瑞.美国政府半导体研发最新战略布局和启示[J].全球科技经济瞭望,2024,39(11-12):1~8 |
| 美国政府半导体研发最新战略布局和启示 |
| Analysis of Strategic Layout of U.S. Government Semiconductor R&D and Enlightenment for China |
| 投稿时间：2024-09-21 |
| DOI： |
| 中文关键词: 美国；国家半导体技术中心；芯片制造研究所；国家先进封装制造计划；芯片计量计划 |
| 英文关键词: the United States; National Semiconductor Technology Center; Manufacturing USA Institute;
National Advanced Packaging Manufacturing Program; Metrology Program |
| 基金项目: |
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| 摘要点击次数: 100 |
| 全文下载次数: 42 |
| 中文摘要: |
| 近年来，随着国际科技竞争的不断加剧，为确保美国在半导体领域的全球领先地位，美国政府
不断加强半导体研发的战略布局。基于美国《芯片和科学法案》以及美国联邦部门的政策行动，梳理分
析了美国政府推进半导体研发的最新战略布局。一是设立国家半导体技术中心作为全国研发的枢纽，
开展先进半导体技术的研究和原型开发；二是建立芯片制造研究所，促进芯片制造流程的创新；三是
设立国家先进封装制造计划，通过封装创新提升芯片性能；四是启动芯片计量计划，推进芯片测量科
学和相关标准。最后对美国政府推进半导体研发的特点进行了分析并提出了几点启示。 |
| 英文摘要: |
| In recent years, with the increasing international scientific and technological competition, the U.S.
government has continuously strengthened the strategic layout of semiconductor research and development to
ensure its global leading position in the semiconductor field. Based on the U.S. Chip and Science Act and the
policy actions of the U.S. federal departments, this paper combs and analyzes the latest strategic layout of the U.S.
government to promote semiconductor research and development. First, setting up the National Semiconductor
Technology Center as the national R&D hub to carry out research and prototype development of semiconductor
technology; Second, establishing Manufacturing USA Institutes to promote the innovation of chip manufacturing
process; Third, setting up National Advanced Packaging Manufacturing Program to improve chip performance
through packaging innovation; Fourth, launching Metrology Program to promote chip measurement science
and related standards. In the end, this paper analyzes the characteristics of the U.S. government’s promotion of
semiconductor R&D and puts forward some enlightenment. |
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