| Zhang Liang(张亮),Liu Zhiquan,Sun Lei,Yang Fan,Zhong Sujuan.Hillock Sn whiskers growth behaviors in Sn0.3Ag0.7Cu/Cu solder joints during corrosion[J].高技术通讯(英文),2018,24(1):113~116 |
| Hillock Sn whiskers growth behaviors in Sn0.3Ag0.7Cu/Cu solder joints during corrosion |
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| Author Name | Affiliation | | Zhang Liang(张亮) | | | Liu Zhiquan | | | Sun Lei | | | Yang Fan | | | Zhong Sujuan | |
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