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  • Contents
    2024 ,30(1):-[Abstract](314)[PDF](294)
  • CHEN Li (陈 丽)*,WANG Xiaoliang* **
    2024 ,30(1):1-12[Abstract](249)[PDF](265)
  • QI Donglin (亓东林),CHEN Shudong,DU Rong,TONG Da,YU Yong
    2024 ,30(1):13-22[Abstract](270)[PDF](247)
  • HU Zhentao(胡振涛)*,HU Chonghao*,YANG Haoran*,SHUAI Weiwei**
    2024 ,30(1):23-30[Abstract](212)[PDF](243)
  • DENG Junyong(邓军勇)*,WANG Junjie *,JIANG Lin **,XIE Xiaoyan ***,ZHOU Kai *
    2024 ,30(1):31-42[Abstract](220)[PDF](244)
  • ZHAO Zhigang(赵志刚),ZHAO Xiangtang,WEI Qizhe,SU Cheng,MENG Jiadong
    2024 ,30(1):43-51[Abstract](222)[PDF](218)
  • LI Nan(李 楠)* ** ***,ZHAO Yongwei**,ZHI Tian**,LIU Chang** ***,DU Zidong**,HU Xing**,LI Wei**,ZHANG Xishan** ***,LI Ling****,SUN Guangzhong*
    2024 ,30(1):52-60[Abstract](241)[PDF](248)
  • LIU Tianmeng(刘天蒙)* **,YANG Hai xiao* **,WU Hong* ** ***
    2024 ,30(1):61-67[Abstract](194)[PDF](231)
  • DONG Qiyang(董琪阳),MA Tianming,JIN Jie,WU Zhong
    2024 ,30(1):68-74[Abstract](230)[PDF](246)
  • LIU Na(刘 娜),CHENG Jiaxin,DUAN Yukai
    2024 ,30(1):75-84[Abstract](230)[PDF](234)
  • TAO Yong(陶 永)* **,XUE Jiao **,WEI Hongxing *,LIU Haitao *,GAO He **,WANG Tianmiao *
    2024 ,30(1):85-98[Abstract](223)[PDF](229)
  • WANG Zhenyu(王振宇),WANG Lei
    2024 ,30(1):99-108[Abstract](202)[PDF](246)

Past publicationmore>>

  • 2024
    (1)

  • 2023
    (4)

  • 2023
    (3)

  • 2023
    (2)

  • 2023
    (1)

  • 2022
    28 (4)

Copyright information

  • Supervised by:

    Ministry of Science and Technology of the People's Republic of China

  • Sponsored by:

    Institute of Scientific and Technical Information of China

  • Published by:

    High Technology Letters Press

  • Add:

    54 Sanlihe Road, High Technology Letters, Beijing 100045 P.R.China

  • Tel:

    86-10-68514060 68598272

  • E-mail:

    hitech@istic.ac.cn

  • CN:

    11-3683/N

  • ISSN:

    1006-6748

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