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  • Contents
    2020 ,26(4):-[Abstract](570)[PDF](1413)
  • Yan Wei （闫伟），He Lidong，Zhu Gang，Wang Shengli，Deng Zhe
    2020 ,26(4):349-359[Abstract](393)[PDF](392)
  • Xu Lei（徐磊），Wang Zhaorui，Yao Yijing，Zhao Xinying，Fang Hongyu，Li Xiaohui
    2020 ,26(4):360-366[Abstract](379)[PDF](380)
  • Xing Jian (邢剑)* ** ***，Wang Shupeng* **，Ding Yu* **
    2020 ,26(4):367-371[Abstract](390)[PDF](384)
  • Wu Jin (吴进)，Min Yu，Shi Qianwen，Zhang Weihua，Zhao Bo
    2020 ,26(4):372-382[Abstract](393)[PDF](367)
  • Wang Xiaohua (王小华)* **，Ma Pin**，Wang Hua* **，Li Li* **
    2020 ,26(4):383-389[Abstract](391)[PDF](379)
  • Guo Ruolin (郭若琳)，Qin Danyang，Zhao Min，Xu Guangchao
    2020 ,26(4):390-401[Abstract](374)[PDF](369)
  • Hu Zhentao(胡振涛)*，Mao Yihao*，Fu Chunling**，Liu Xianxing*
    2020 ,26(4):402-410[Abstract](376)[PDF](358)
  • Liu Tingting (刘婷婷)，Wang Yuntian**，Wang Junhua***，Pan Ziyu*，Yu Yu*
    2020 ,26(4):411-416[Abstract](368)[PDF](351)
  • Nie Tongtong (聂彤彤)*，Wu Wenjun*，He Qichang*，Zhang Xuanyi**，Sun Yang*，Zhang Yanhua*
    2020 ,26(4):417-423[Abstract](429)[PDF](449)
  • Shan Rui（山蕊）*，Deng Junyong*，Jiang Lin**，Zhu Yun*，Wu Haoyue*，He Feilong*
    2020 ,26(4):424-434[Abstract](399)[PDF](620)
  • Zhang Qi (张琪)* **，Zhang Xu*，Li Caili***，Liu Jianchao***，Liu Ming*，Yuan Fang*，Chen Hongda*
    2020 ,26(4):435-441[Abstract](374)[PDF](351)
  • Xu Yilong (徐翼龙)*，Li Wenfa**，Wang Gongming*** ****，Huang Lingyun*****
    2020 ,26(4):442-447[Abstract](444)[PDF](531)
  • Hao Renzhi (郝任之)*，Li Jun** ***，Wu Guangjun***
    2020 ,26(4):448-454[Abstract](375)[PDF](371)
  • Li Xiaohua（李晓华）* **，Guo Mingqiang***，Qi Xinhong**
    2020 ,26(4):455-459[Abstract](395)[PDF](362)

Past publicationmore>>

  • 2020
    26 (4)

  • 2020
    26 (3)

  • 2020
    26 (2)

  • 2020
    26 (1)

  • 2019
    25 (4)

  • 2019
    25 (3)

Copyright information

  • Supervised by:

    Ministry of Science and Technology of the People's Republic of China

  • Sponsored by:

    Institute of Scientific and Technical Information of China

  • Published by:

    High Technology Letters Press

  • Add:

    54 Sanlihe Road, High Technology Letters, Beijing 100045 P.R.China

  • Tel:

    86-10-68514060 68598272

  • E-mail:

    hitech@istic.ac.cn

  • CN：

    11-3683/N

  • ISSN：

    1006-6748

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