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  • Contents
    2023 ,29(3):-[Abstract](58)[PDF](71)
  • WANG Dong (王东)，LI Guizhi，SUN Xiaojing，WANG Changqing
    2023 ,29(3):223-230[Abstract](64)[PDF](79)
  • SUN Yuantao(孙远韬)*，ZHANG Min*，YUAN Lindong**
    2023 ,29(3):231-246[Abstract](54)[PDF](66)
  • KONG Deshun(孔德顺)* **，GAO Xiangsheng*** ****，JIANG Huizeng* **
    2023 ,29(3):247-256[Abstract](57)[PDF](436)
  • ZHANG Xingguo(张兴国)* **，HU Binghua**，WANG Yuanliang***，YAN Hui**，MA Xiaodong**，GE Quanbo****
    2023 ,29(3):257-268[Abstract](389)[PDF](195)
  • PENG Fei(彭斐)，CHEN Shudong，QI Donglin，YU Yong，TONG Da
    2023 ,29(3):269-278[Abstract](51)[PDF](64)
  • WANG Tengda(王腾达)*，WU Wenjun*，YANG Feng*，SUN Teng**，GAO Qiang*
    2023 ,29(3):279-287[Abstract](56)[PDF](62)
  • LIU Yang(刘洋)，HE Jinglin，WANG Bin，ZHANG Yuzhi
    2023 ,29(3):288-294[Abstract](54)[PDF](56)
  • JIN Kaiqi (金凯琦)，WU Wenjun，GAO Yang，YIN Yufen，SI Pengbo
    2023 ,29(3):295-304[Abstract](53)[PDF](64)
  • XIAO Zhifang(肖志芳)*，ZHONG Guoxuan**，CHEN Jianqi*，GUO Chen* **，PENG Shuo*
    2023 ,29(3):305-309[Abstract](54)[PDF](64)
  • LIU Wenbin(刘文斌)，HE Yanqing，LAN Tian，WU Zhenfeng
    2023 ,29(3):310-317[Abstract](46)[PDF](131)
  • CHEN Lei (陈雷)*，CAO Peilin**，BAI Jinghao*，ZHANG Ting***
    2023 ,29(3):318-324[Abstract](56)[PDF](59)
  • SHAO Qing(邵清)，ZHANG Wenshuang，WANG Shaojun
    2023 ,29(3):325-334[Abstract](53)[PDF](62)

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  • 2023
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  • 2023
    (1)

  • 2022
    28 (4)

  • 2022
    28 (3)

  • 2022
    28 (2)

Copyright information

  • Supervised by:

    Ministry of Science and Technology of the People's Republic of China

  • Sponsored by:

    Institute of Scientific and Technical Information of China

  • Published by:

    High Technology Letters Press

  • Add:

    54 Sanlihe Road, High Technology Letters, Beijing 100045 P.R.China

  • Tel:

    86-10-68514060 68598272

  • E-mail:

    hitech@istic.ac.cn

  • CN：

    11-3683/N

  • ISSN：

    1006-6748

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