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  • Contents
    2022 ,28(4):-[Abstract](105)[PDF](1232)
  • YANG Ruizhe(杨睿哲)*，ZHAO Xuehui*，ZHANG Yanhua*，SI Pengbo*，TENG Yinglei**
    2022 ,28(4):337-344[Abstract](738)[PDF](410)
  • SHAN Rui(山蕊)*，GAO Xu*，FENG Yani*，HUI Chao*，CUI Xinyue*，CHAI Miaomiao**
    2022 ,28(4):345-353[Abstract](84)[PDF](3391)
  • HU Zhentao（胡振涛）*，JIA Haoqian*，GONG Delong**
    2022 ,28(4):354-362[Abstract](73)[PDF](111)
  • XIA Chunwei(夏春伟)* **，ZHAO Jiacheng*，CUI Huimin* **，FENG Xiaobing* **
    2022 ,28(4):363-372[Abstract](75)[PDF](103)
  • WANG Yi(王翊)，HUANG Rong，XU Yaohua，JIANG Fang，BAI Na，TANG Tao，HU Yanjun
    2022 ,28(4):373-383[Abstract](185)[PDF](214)
  • YANG Xining (杨喜宁)**，ZHOU Yiqing* **，CHEN Yang**
    2022 ,28(4):384-391[Abstract](82)[PDF](101)
  • JIANG Lin(蒋林)**，DUAN Xueyao*，XIE Xiaoyan***
    2022 ,28(4):392-400[Abstract](84)[PDF](102)
  • WU Jin(吴进)，DAI Wei，WANG Yu，ZHAO Bo
    2022 ,28(4):401-410[Abstract](78)[PDF](359)
  • WANG Jinhong (王进洪)*，LEI Jingtao* **
    2022 ,28(4):411-417[Abstract](67)[PDF](105)
  • DONG Huaiyu（董怀玉），HE Lidong，JIA Xingyun
    2022 ,28(4):418-424[Abstract](71)[PDF](94)
  • WANG Xiaojing (王晓晶)* **，HUO Shuhang***，LI Wenjie***
    2022 ,28(4):425-433[Abstract](88)[PDF](83)
  • WANG Yangyang (王洋洋)*，PAN Xin*，GAO Jinji**，WU Haiqi *
    2022 ,28(4):434-439[Abstract](74)[PDF](82)
  • PENG Cheng(彭程)，QIAO Guanyu，CAI Lihua
    2022 ,28(4):440-450[Abstract](74)[PDF](90)

Past publicationmore>>

  • 2022
    28 (4)

  • 2022
    28 (3)

  • 2022
    28 (2)

  • 2022
    28 (1)

  • 2021
    27 (4)

  • 2021
    27 (3)

Copyright information

  • Supervised by:

    Ministry of Science and Technology of the People's Republic of China

  • Sponsored by:

    Institute of Scientific and Technical Information of China

  • Published by:

    High Technology Letters Press

  • Add:

    54 Sanlihe Road, High Technology Letters, Beijing 100045 P.R.China

  • Tel:

    86-10-68514060 68598272

  • E-mail:

    hitech@istic.ac.cn

  • CN：

    11-3683/N

  • ISSN：

    1006-6748

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