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  • Contents
    2020 ,26(4):-[Abstract](570)[PDF](1413)
  • Yan Wei (闫伟),He Lidong,Zhu Gang,Wang Shengli,Deng Zhe
    2020 ,26(4):349-359[Abstract](393)[PDF](392)
  • Xu Lei(徐磊),Wang Zhaorui,Yao Yijing,Zhao Xinying,Fang Hongyu,Li Xiaohui
    2020 ,26(4):360-366[Abstract](379)[PDF](380)
  • Xing Jian (邢剑)* ** ***,Wang Shupeng* **,Ding Yu* **
    2020 ,26(4):367-371[Abstract](390)[PDF](384)
  • Wu Jin (吴进),Min Yu,Shi Qianwen,Zhang Weihua,Zhao Bo
    2020 ,26(4):372-382[Abstract](393)[PDF](367)
  • Wang Xiaohua (王小华)* **,Ma Pin**,Wang Hua* **,Li Li* **
    2020 ,26(4):383-389[Abstract](391)[PDF](379)
  • Guo Ruolin (郭若琳),Qin Danyang,Zhao Min,Xu Guangchao
    2020 ,26(4):390-401[Abstract](374)[PDF](369)
  • Hu Zhentao(胡振涛)*,Mao Yihao*,Fu Chunling**,Liu Xianxing*
    2020 ,26(4):402-410[Abstract](376)[PDF](358)
  • Liu Tingting (刘婷婷),Wang Yuntian**,Wang Junhua***,Pan Ziyu*,Yu Yu*
    2020 ,26(4):411-416[Abstract](368)[PDF](351)
  • Nie Tongtong (聂彤彤)*,Wu Wenjun*,He Qichang*,Zhang Xuanyi**,Sun Yang*,Zhang Yanhua*
    2020 ,26(4):417-423[Abstract](429)[PDF](449)
  • Shan Rui(山蕊)*,Deng Junyong*,Jiang Lin**,Zhu Yun*,Wu Haoyue*,He Feilong*
    2020 ,26(4):424-434[Abstract](399)[PDF](620)
  • Zhang Qi (张琪)* **,Zhang Xu*,Li Caili***,Liu Jianchao***,Liu Ming*,Yuan Fang*,Chen Hongda*
    2020 ,26(4):435-441[Abstract](374)[PDF](351)
  • Xu Yilong (徐翼龙)*,Li Wenfa**,Wang Gongming*** ****,Huang Lingyun*****
    2020 ,26(4):442-447[Abstract](444)[PDF](531)
  • Hao Renzhi (郝任之)*,Li Jun** ***,Wu Guangjun***
    2020 ,26(4):448-454[Abstract](375)[PDF](371)
  • Li Xiaohua(李晓华)* **,Guo Mingqiang***,Qi Xinhong**
    2020 ,26(4):455-459[Abstract](395)[PDF](362)

Past publicationmore>>

  • 2020
    26 (4)

  • 2020
    26 (3)

  • 2020
    26 (2)

  • 2020
    26 (1)

  • 2019
    25 (4)

  • 2019
    25 (3)

Copyright information

  • Supervised by:

    Ministry of Science and Technology of the People's Republic of China

  • Sponsored by:

    Institute of Scientific and Technical Information of China

  • Published by:

    High Technology Letters Press

  • Add:

    54 Sanlihe Road, High Technology Letters, Beijing 100045 P.R.China

  • Tel:

    86-10-68514060 68598272

  • E-mail:

    hitech@istic.ac.cn

  • CN:

    11-3683/N

  • ISSN:

    1006-6748

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