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  • Contents
    2022 ,28(3):-[Abstract](66)[PDF](862)
  • LUO Chunjie (罗纯杰)，ZHAN Jianfeng
    2022 ,28(3):227-236[Abstract](39)[PDF](50)
  • HOU Wei(侯巍)，HU Zhentao，LIU Xianxing，SHI Changsen
    2022 ,28(3):237-246[Abstract](25)[PDF](41)
  • ZHANG Zhong（张重）*，LV Shijie*，LIU Shuang*，XIAO Baihua**
    2022 ,28(3):247-251[Abstract](580)[PDF](166)
  • HE Jiai(何继爱)，CHEN Yanjiao，WANG Tong
    2022 ,28(3):252-258[Abstract](38)[PDF](41)
  • GONG Xunwu (龚循武)* **，HU Bin*，LIU Xiaodong*，ZHAO Xiaofang* ***
    2022 ,28(3):259-271[Abstract](20)[PDF](34)
  • WANG Xiaohua (王小华)，LIAO Zhonghe，MA Pin，MIAO Zhonghua
    2022 ,28(3):272-279[Abstract](21)[PDF](33)
  • SHENG Wenshun (圣文顺)*，SUN Yanwen**，XU Liujing*
    2022 ,28(3):280-287[Abstract](131)[PDF](180)
  • HU Bo (呼博)，YANG Lihua，REN Lulu，NIE Qian
    2022 ,28(3):288-294[Abstract](43)[PDF](1866)
  • ZHAO Wencang (赵文仓)，QIN Wenqian，LI Ming
    2022 ,28(3):295-306[Abstract](28)[PDF](32)
  • ZHANG Jun (张军)*，WANG Xingbin**，GUO Binglei*
    2022 ,28(3):307-316[Abstract](26)[PDF](41)
  • LI Geng(李耕)，HE Lidong，JIA Xingyun，ZHANG Yipeng，WANG Jian
    2022 ,28(3):317-327[Abstract](21)[PDF](30)
  • WANG Zhiqiang(王志强)* **，DAI Zejun*，LI Xinglin***，HE Wen**，GAO Dianrong****
    2022 ,28(3):328-336[Abstract](37)[PDF](45)

Past publicationmore>>

  • 2022
    28 (3)

  • 2022
    28 (2)

  • 2022
    28 (1)

  • 2021
    27 (4)

  • 2021
    27 (3)

  • 2021
    27 (2)

Copyright information

  • Supervised by:

    Ministry of Science and Technology of the People's Republic of China

  • Sponsored by:

    Institute of Scientific and Technical Information of China

  • Published by:

    High Technology Letters Press

  • Add:

    54 Sanlihe Road, High Technology Letters, Beijing 100045 P.R.China

  • Tel:

    86-10-68514060 68598272

  • E-mail:

    hitech@istic.ac.cn

  • CN：

    11-3683/N

  • ISSN：

    1006-6748

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