| LIU Xuan(刘 璇),ZHANG Mingchao,LIU Chengwen,ZHOU Chuanan,LV Xiaoling.[J].高技术通讯(英文),2024,30(2):170~178 |
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| Heat dissipation enhancement method for finned heat sink for AGV motor driver's IGBT module |
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| DOI：10. 3772 / j. issn. 1006-6748. 2024. 02. 008 |
| 中文关键词: |
| 英文关键词: finned heat sink , insulated gate bipolar transistor ( IGBT) module , heat dissipation , orthogonal test , response surface methodology |
| 基金项目: |
| Author Name | Affiliation | | LIU Xuan(刘 璇) | ( School of Mechanical Engineering , Hebei University of Technology , Tianjin 300401 , P. R. China) | | ZHANG Mingchao | | | LIU Chengwen | | | ZHOU Chuanan | | | LV Xiaoling | |
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| 中文摘要: |
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| 英文摘要: |
| With the widespread use of high-power and highly integrated insulated gate bipolar transistor (IGBT) , their cooling methods have become challenging. This paper proposes a liquid cooling scheme for heavy-duty automated guided vehicle ( AGV)motor driver in port environment , and improves heat dissipation by analyzing and optimizing the core component of finned heat sink. Firstly , the temperature distribution of the initial scheme is studied by using Fluent software , and the heat transfer characteristics of the finned heat sink are obtained through numerical analysis. Secondly , an orthogonal test is designed and combined with the response surface methodology to optimize the structural parameters of the finned heat sink , resulting in a 14 . 57% increase in the heat dissipation effect. Finally , the effectiveness of heat dissipation enhancement is verified. This work provides valuable insights into improving the heat dissipation of IGBT modules and heat sinks , and provides guidance for their future applications. |
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