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  • Contents
    2024 ,30(2):-[Abstract](99)[PDF](258)
  • WANG Weifeng (王伟峰),YANG Ze,LI Zhao,ZHAO Xuanchong
    2024 ,30(2):109-116[Abstract](108)[PDF](318)
  • TIAN Shu (田 澍),ZHOU Hongyang
    2024 ,30(2):117-127[Abstract](67)[PDF](82)
  • DENG Junyong(邓军勇)*,ZHANG Pan*,JIANG Lin**,XIE Xiaoyan***,DENG Jingwen*
    2024 ,30(2):128-137[Abstract](101)[PDF](147)
  • XU Zhenyu(徐振宇)*,HUA Yongzhu**,CUI Jiadong**,LI Chuangwei**
    2024 ,30(2):138-145[Abstract](65)[PDF](83)
  • LIU Hongmei (刘洪美)*,LI Shengguo**,SUN Chao**,SUN Yanan**,ZHAO Jianhua***
    2024 ,30(2):146-157[Abstract](62)[PDF](87)
  • HE Shuo (何 烁)*,BAI Huifeng**,HUO Chao**,ZHANG Ganghong**
    2024 ,30(2):158-163[Abstract](58)[PDF](78)
  • SUN Yanan (孙亚南)*,LIANG Qiuhui **,WANG Wentao *,YANG Guang *,ZHANG Wei **
    2024 ,30(2):164-169[Abstract](70)[PDF](79)
  • LIU Xuan(刘 璇),ZHANG Mingchao,LIU Chengwen,ZHOU Chuanan,LV Xiaoling
    2024 ,30(2):170-178[Abstract](58)[PDF](153)
  • WANG Yunzhe(王蕴哲),MA Tianming,JIANG Xiaoxiao,MA Honglei
    2024 ,30(2):179-187[Abstract](61)[PDF](81)
  • ZHOU Yu(周 玉) *,LI Yue *,ZHAO Shuangshuang *,GAO Fan *,ZHOU Chao *,MU Zhuowen *,CHEN Rui **
    2024 ,30(2):188-198[Abstract](62)[PDF](80)
  • JI Qi(季 琦) *,LI Wei **,PAN Bailin *,XUE Hongkai ***,QIU Xiang ***
    2024 ,30(2):199-210[Abstract](59)[PDF](80)
  • SHAN Rui (山 蕊),LI Xiaoshuo,GAO Xu,HUO Ziqing
    2024 ,30(2):211-220[Abstract](114)[PDF](77)

Past publicationmore>>

  • 2024
    (2)

  • 2024
    (1)

  • 2023
    (4)

  • 2023
    (3)

  • 2023
    (2)

  • 2023
    (1)

Copyright information

  • Supervised by:

    Ministry of Science and Technology of the People's Republic of China

  • Sponsored by:

    Institute of Scientific and Technical Information of China

  • Published by:

    High Technology Letters Press

  • Add:

    54 Sanlihe Road, High Technology Letters, Beijing 100045 P.R.China

  • Tel:

    86-10-68514060 68598272

  • E-mail:

    hitech@istic.ac.cn

  • CN:

    11-3683/N

  • ISSN:

    1006-6748

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