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  • Cover
    2026 ,32(1):-[Abstract](27)[PDF](26)
  • Contents
    2026 ,32(1):-[Abstract](25)[PDF](23)
  • Jiang Jiewei (蒋杰伟)*，Cui Yiwei*，Yao Qihai*，Wang Ning*，Li Kuan*，Li Zhongwen**
    2026 ,32(1):1-10[Abstract](26)[PDF](28)
  • Chen Zhenyu (陈振宇)*，Yan Huaguang* ****，Du Jianguang*，Xue Meng**，Zhao Shuai***
    2026 ,32(1):11-20[Abstract](34)[PDF](34)
  • Pan Kunbei (潘坤贝)*，Wang Jiaming*，Zhou Bin**，Huang Bo*，Huang Yanjun***
    2026 ,32(1):21-29[Abstract](25)[PDF](26)
  • Wu Jin (吴 进)，Xiong Hao，Luo Wenxuan，Hao Chengbin
    2026 ,32(1):30-38[Abstract](18)[PDF](22)
  • Liu Dongyue (刘东岳)*，Jiang Lin**，Wang Mei* **，Li Yuancheng***，Hao Juan****
    2026 ,32(1):39-48[Abstract](20)[PDF](24)
  • Li Heng(李 恒)，Zhu Gongcai，Liu Andong，Ni Hongjie
    2026 ,32(1):49-59[Abstract](23)[PDF](27)
  • Zhang Qijia (张琪佳)，Qin Danyang，Zhang Xiao
    2026 ,32(1):60-72[Abstract](27)[PDF](28)
  • Jiang Yanjun (姜燕君)*，Wang Yijing**，Yang Ruiqi***，Li Ali****
    2026 ,32(1):73-83[Abstract](26)[PDF](24)
  • Peng Siyu (彭思雨)* **，Li Dingxin*，Wang Huan*，Li Fang*，TIAN Dongping*，Shi Zhongzhi***
    2026 ,32(1):84-96[Abstract](23)[PDF](29)
  • Zhang Maosong (张茂松)*，Zhang Chunyu*，Hao Shi*，Yang Jie**，Yang Lingxiao***，Wang Xiuqin*
    2026 ,32(1):97-108[Abstract](30)[PDF](31)

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  • 2026
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  • 2025
    31 (4)

  • 2025
    31 (3)

  • 2025
    31 (2)

  • 2025
    31 (1)

  • 2024
    30 (4)

Copyright information

  • Supervised by:

    Ministry of Science and Technology of the People's Republic of China

  • Sponsored by:

    Institute of Scientific and Technical Information of China

  • Published by:

    High Technology Letters Press

  • Add:

    No. 15, Fuxing Road, Beijing 100038, P.R.China

  • Tel:

    86-10-58882918,58882910

  • E-mail:

    hitech@istic.ac.cn

  • CN：

    11-3683/N

  • ISSN：

    1006-6748

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Sponsored by: Institute of Scientific and Technical Information of China Add: No. 15, Fuxing Road, Beijing 100038, P.R.China
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