文章摘要
Zhang Liang (张亮),Yang Fan,Zhong Sujuan.[J].高技术通讯(英文),2017,23(3):337~341
ZnO whiskers growth on the surface of Sn9Zn/Cu solder joints in concentrator silicon solar cells solder layer
  
DOI:10.3772/j.issn.1006-6748.2017.03.016
中文关键词: 
英文关键词: ZnO whiskers, reflow soldering, short circuiting failure, electronic device
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Author NameAffiliation
Zhang Liang (张亮)  
Yang Fan  
Zhong Sujuan  
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中文摘要:
      
英文摘要:
      ZnO whiskers observation on the surface of SnZn/Cu solder joints in concentrator silicon solar cells solder layer is reported. In the experiment, SnZn/Cu samples are left in laboratory after reflow soldering for two years before an examination by SEM, then ZnO whiskers can be observed obviously, which grows out from the rich-Zn phase of the samples and causes electrical short circuit in the electronics appliances, which demonstrates that the SnZn solder shows a risk for the short circuiting failure of an electronic device. Moreover, the growth mechanism of ZnO whiskers is researched based on cracked oxide theory, which provides the reference support for SnZn solders application.
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