文章摘要
LIU Xuan(刘 璇),ZHANG Mingchao,LIU Chengwen,ZHOU Chuanan,LV Xiaoling.[J].高技术通讯(英文),2024,30(2):170~178
Heat dissipation enhancement method for finned heat sink for AGV motor driver's IGBT module
  
DOI:10. 3772 / j. issn. 1006-6748. 2024. 02. 008
中文关键词: 
英文关键词: finned heat sink , insulated gate bipolar transistor ( IGBT) module , heat dissipation , orthogonal test , response surface methodology
基金项目:
Author NameAffiliation
LIU Xuan(刘 璇) ( School of Mechanical Engineering , Hebei University of Technology , Tianjin 300401 , P. R. China) 
ZHANG Mingchao  
LIU Chengwen  
ZHOU Chuanan  
LV Xiaoling  
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中文摘要:
      
英文摘要:
      With the widespread use of high-power and highly integrated insulated gate bipolar transistor (IGBT) , their cooling methods have become challenging. This paper proposes a liquid cooling scheme for heavy-duty automated guided vehicle ( AGV)motor driver in port environment , and improves heat dissipation by analyzing and optimizing the core component of finned heat sink. Firstly , the temperature distribution of the initial scheme is studied by using Fluent software , and the heat transfer characteristics of the finned heat sink are obtained through numerical analysis. Secondly , an orthogonal test is designed and combined with the response surface methodology to optimize the structural parameters of the finned heat sink , resulting in a 14 . 57% increase in the heat dissipation effect. Finally , the effectiveness of heat dissipation enhancement is verified. This work provides valuable insights into improving the heat dissipation of IGBT modules and heat sinks , and provides guidance for their future applications.
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